5747845-3
15 MSFL RCPT RA 318 (IN,FM,BL)
The 5747845-3, a high-performance D-Sub connector designed for reliable board mount applications. With UL 94V-0 standards met, this receptacle ensures enhanced safety and durability. Featuring 15 gold flash plated contacts made of phosphor bronze, it guarantees excellent conductivity and signal integrity. The thermoplastic housing and front metal shell provide robust protection, while the threaded insert mating retention type offers secure connections. With a pitch of 2.74mm and 2 rows of 15 positions, this connector is perfect for high-density applications. RoHS compliant and available for immediate shipping, the 5747845-3 is the ideal choice for demanding industrial and commercial environments.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5747845-3 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 15 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Flash |
| Pitch: | 2.74 mm |
| Number of Positions: | 15 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747845-3 |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Insert Material: | Zinc |
| Plastic: | No |
| Eyelet Plating Material: | Tin |
| Shell Material: | Carbon Steel |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| Contact Base Material: | Phosphor Bronze |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Material: | Thermoplastic |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Mating Retention: | With |
| Connector Mounting Type: | Board Mount |
| PCB Mount Retention Type: | Boardlock |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Threaded Insert Material: | Zinc |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Boardlock Plating Material: | Tin over Nickel |
| Boardlock Material: | Copper Alloy |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shell Size: | 2 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | No |
| Grounding Straps: | With |
| Product Type: | Connector |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |