5414459-1
BNC, RT ANG, PCB, JACK
Part Aliases: TE Connectivity 1462726
BNC RT ANG PCB JACK is a high-performance RF connector designed for seamless printed circuit board integration. Featuring a durable construction with a body orientation of right angle, this connector ensures reliable signal transmission in space-restricted applications. With a mating type of bayonet and impedance of 75 Ω, it is ideal for high-frequency operations up to 2 GHz. The gold-plated beryllium copper contacts guarantee excellent conductivity and signal integrity, while the polyester PBT body offers superior durability. With a single port configuration and rear mount panel attachment, this BNC connector is a versatile and dependable choice for your RF coaxial connection needs. RoHS compliant.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5414459-1 |
| Series: | OEG Miniature Relay PCF |
| Gender: | Jack |
| Mount Type: | Panel |
| Termination Method: | Through Hole |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Mating Type: | Bayonet |
| Impedance: | 75 Ω |
| Operating Frequency: | 2 GHz |
| RF Connector Type: | BNC |
| Body Material: | Polyester, PBT |
| Number of Positions: | 1 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Interface: | BNC |
| GPL: | 076 |
| Port Configuration: | Single Port |
| Tail Length: | .162 in, 4.11 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Panel Mount: | Rear Mount |
| PCB Retention: | With |
| PCB Retention Type: | Hold-Down Post |
| Panel Mount Type: | Lockwasher and Nut |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3137 |
| Number of Coaxial Contacts: | 1 |
| Mounting Post Length: | .137 in, 3.48 mm |
| Body Insulation: | Without |
| Body Plating Material: | Nickel |
| Center Contact Plating Material: | Gold |
| Center Contact Material: | Beryllium Copper |
| Center Contact Plating Thickness: | 30 µin |
| Detent: | With |
| Dielectric Material: | Polymethylpentene |
| Height Above PC Board: | 15.88 mm, .625 in |
| Contact Captivation Method: | Mechanical |
| Mated Outer Diameter (Approximate): | 14.529 mm, .572 in |
| Product Grade: | Commercial |
| Connector System: | Cable to Board |
| Panel Attachment Style: | Rear Mount |
| Part Aliases: | 1462726 5414459-1 |
| SKU: | AMP5414459-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |