| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2302795-1 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 32 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | , |
| Circuit Application: | Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | X942 |
| Number of Columns: | 16 |
| Number of Signal Positions: | 8 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 40 |
| Signal Arrangement: | Differential |
| Part Aliases: | null 2302795-1 |
| SKU: | AMP2302795-1 |
2302795-1
| ICC Number: | AMP2302795-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2302795-1 |
| Datasheet: | 3D Model (PDF) |
| ECAD Model: |
Specifications
Detailed Description
The RAPLUGASSY is a high-performance daughtercard connector designed for aerospace, defense, and marine applications. Featuring a rugged LCP-GF housing, this right-angle board mount connector is ideal for signal transmission in harsh environments. With 112 positions arranged in 16 columns, including 32 pairs and 40 ground positions, it offers ample connectivity options. Each row of the connector is spaced 1.35mm apart, with a pitch of 1.8mm, ensuring efficient signal transmission. Operating at an impedance of 100Ω, with 1A amperage, the RAPLUGASSY guarantees reliable performance. Its through-hole press-fit termination method and keyed mating alignment provide secure and accurate connections. RoHS non-compliant. ( 2302795-1)
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 2302794-1 | RAPLUGASSY,CENTERRP0,RTM,VPX,MGRT3 |  |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 09/30/2026 | P-26-031489 - Due date Extended. Due date for mixed shipments per TE PCNs P-25-028147 and P-25-028148 has expired. This is to extend the due date to allow mixed shipments of component parts. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| TE Connectivity: | 2302795-1 |
| Other Names: | null |