| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2302794-1 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 20 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Circuit Application: | Power & Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | X942 |
| Number of Columns: | 16 |
| Number of Power Positions: | 4 |
| Number of Signal Positions: | 20 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 31 |
| Part Aliases: | null 2302794-1 |
| SKU: | AMP2302794-1 |
2302794-1
| ICC Number: | AMP2302794-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2302794-1 |
| Datasheet: | Product Specification |
| ECAD Model: |
Specifications
Detailed Description
The RAPLUGASSY Multigig RT 3 Connector, part number 2302794-1, is a high-performance daughtercard connector designed for power and signal applications in aerospace, defense, and marine industries. With a current rating of 1A and 100Ω impedance, this right-angle board-to-board connector features 112 positions arranged in 7 rows, with 20 pairs for efficient signal transmission. Constructed with LCP-GF housing material and featuring through-hole press-fit termination, it offers robust and reliable connectivity. This connector, not RoHS compliant, is in stock and ready for immediate shipping, making it ideal for high-reliability applications in harsh environments.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 2302795-1 | RAPLUGASSY,CENTERDP,RTM,VPX,MG RT3 |  |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/02/2026 | P-26-029646 - Tool Duplication.we hereby inform you about a replacement duplicate stamping tool for the contacts used in the listed part numbers. The validation for this new tool is executed by following a strict procedure, which mitigates risk of negative influence on quality and ability to supply. This is not a Form, Fit, or Function change. An internal release based on our specifications will be executed before any parts are delivered. There is no last date for mix shipment because we will not mix contacts stamped on the old tool die and new tool die in the assemblies. There is no last date for mix shipment because we do not want to mix the contacts in the assemblies from the old die and new die. | Download | |||
| 01/12/2026 | PCN-25-266689 - Drawing Change. On TE Customer Drawing change 1.41 dimension to 1.41 REF, change 1.20 to 1.20 REF. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| TE Connectivity: | 2302794-1 |
| Other Names: | null |