| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102870-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | .75 A |
| Gender: | Plug |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .071 mm, 1.8 mm |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | J543 |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Right |
| Part Aliases: | 2102870-1 |
| SKU: | AMP2102870-1 |
2102870-1
| ICC Number: | AMP2102870-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2102870-1 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Specifications
Detailed Description
Introducing the 2102870-1, a high-performance backplane connector designed for demanding applications in the aerospace, defense, and marine industries. This rugged connector features a 7-row configuration with 112 positions, allowing for efficient power and signal transmission. With a low amperage of .75 A and operating temperature range of -55 to 125°C (-67 to 257°F), it ensures reliable performance in harsh environments. The right-angle board-to-board design with a pitch of 1.9 mm (.075 in) offers secure and space-saving connections, while the fully shrouded construction provides enhanced protection. RoHS non-compliant.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 1-1469492-8 | MULTIGIG RT 9MM GUIDE/ESD 315 DEG |  |
 | TE Connectivity 1-1469492-9 | MULTIGIG RT 9MM GUIDE/ESD UNKE | |
 | TE Connectivity 1-6450869-4 | V/R 2ACP+1LP+32S+3HDP+1LP+1P | |
 | TE Connectivity 1410187-3 | MULTIGIG RT T2 7RW DC DF CT | |
 | TE Connectivity 1410189-3 | MULTIGIG RT T2 7RW H-LFT,ET2 | |
 | TE Connectivity 2102737-1 | BP, Right End, MULTIGIG RT 2R | |
 | TE Connectivity 5352068-1 | Z-PACK/A RAF 110P | |
 | TE Connectivity 60618-5 | CMNL PIN AUBR L/P | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/02/2026 | P-26-029646 - Tool Duplication.we hereby inform you about a replacement duplicate stamping tool for the contacts used in the listed part numbers. The validation for this new tool is executed by following a strict procedure, which mitigates risk of negative influence on quality and ability to supply. This is not a Form, Fit, or Function change. An internal release based on our specifications will be executed before any parts are delivered. There is no last date for mix shipment because we will not mix contacts stamped on the old tool die and new tool die in the assemblies. There is no last date for mix shipment because we do not want to mix the contacts in the assemblies from the old die and new die. | Download | |||
| 01/12/2026 | PCN-25-266374 - Drawing Update. Change TE Customer Drawing to be consistent with TE Production Drawing. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |