2007778-3

AMP2007778-3
ICC Number:AMP2007778-3
Manufacturer:TE Connectivity
Manufacturer Number:2007778-3
Datasheet:Drawing
ECAD Model:
3D Model

Description:

IMP100S,H,V3P10C,LG,REW46,5.5

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007778-3
Series:IMPACT
Amperage:.75 A
Connector Type:Header
Gender:Plug
Housing Material:LCP - GF (Liquid Crystal Polymer)
Number of Rows:9
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Pin
Contact Length:.217 in, 26.9 mm, 5.5 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.018 in, .46 mm
Number of Pairs:30
Number of Positions:90
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Vertical
GPL:K74
Tail Length:.055 in, 1.4 mm
Packaging:Box & Tube, Tube
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:24.6 mm, .969 in
PCB Retention Type:Action/Compliant Tail & Screw
Sealable:No
Mating Alignment:With
Mating Alignment Type:Keyed
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L346
Number of Columns:10
Number of Signal Positions:60
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:1.059 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:3
Contact Style:Press-Fit
Board to Board Configuration:Right Angle
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:16.7 mm, .657 in
Mating Retention:Without
Make First / Break Last:No
Shroud Type:Fully
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Left
Number of Ground Positions:30
End Wall Location:Right
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2007778-3
SKU:AMP2007778-3

Detailed Description

The IMP100S is a high-speed board-to-board connector designed for signal transmission in demanding applications. Featuring a low impedance of 100 Ω and a data rate of 20-25 Gb/s, this connector is ideal for high-performance systems. With 90 positions arranged in 10 columns, it offers ample connectivity options. The contact design, with dual beam technology, ensures reliable signal transmission, while the inline layout allows for space-efficient board-to-board configuration. Constructed with a durable LCP-GF housing and gold-plated copper alloy contacts, this connector offers excellent performance and reliability in harsh environments. RoHS compliant and UL 94V-0 certified, it meets stringent safety and environmental standards. Perfect for use in data and device applications, the IMP100S is a versatile and reliable connectivity solution.