| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2007705-1 |
| Series: | IMPACT |
| Amperage: | .75 A |
| Connector Type: | Connector Assembly |
| Gender: | Receptacle |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Contacts: | 90 |
| Number of Rows: | 9 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 185 °F, 85 °C |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Socket |
| Contact Length: | 19 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| PCB Hole Diameter: | .015 in, .39 mm |
| Number of Pairs: | 30 |
| Number of Positions: | 90 |
| Data Rate: | 20 - 25 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Right Angle |
| GPL: | K74 |
| Tail Length: | .047 in, 1.2 mm |
| Packaging: | Box & Tube, Package |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .762 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Thickness (Recommended): | 1 mm |
| Connector Height: | 15 mm, .59 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L347 |
| Number of Columns: | 10 |
| Number of Signal Positions: | 60 |
| Contact Design: | Dual Beam |
| Contact Layout: | Inline |
| Contact Transmits: | Signal (Data) |
| Connector Length: | .748 in |
| Connector System: | Board to Board |
| UL Agency Certification: | E28476 |
| Contact Termination Plating: | Tin |
| Stackable: | No |
| Connector Product Type: | Connector |
| Pairs Per Column: | 3 |
| Contact Style: | Press-Fit |
| Board to Board Configuration: | Right Angle |
| Contact Underplating Thickness: | 1.27 µm, 50 µin |
| Connector Width: | 24.2 mm, .953 in |
| Mating Retention: | Without |
| Make First / Break Last: | No |
| Shroud Type: | No |
| PCB Contact Termination Area Plating Thickness: | 1.27 µm, 50 µin |
| Guide Location: | Unguided |
| Number of Ground Positions: | 30 |
| End Wall Location: | None |
| Guide Hardware: | Without |
| Signal Arrangement: | Differential |
| Standards Met: | Yes UL 94V-0 |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2007705-1 |
| SKU: | AMP2007705-1 |
2007705-1
Specifications
Detailed Description
IMP100S,R,RA3P10C,UG,39 is a high-speed board-to-board connector featuring 90 contacts in a right angle, receptacle configuration. With a pitch of 1.9mm and through hole press-fit termination, it offers reliable signal transmission for demanding applications. Constructed with LCP-GF housing material and gold-plated copper alloy contacts, this connector ensures durability and high performance. Rated for 30V AC/DC and 0.75A, it meets stringent standards including UL 94V-0 for flammability. Operating temperature ranging from -55 to 85°C, it is suitable for use in harsh environments. With 30 differential signal pairs and a data rate of 20-25 Gb/s, it is ideal for high-speed data and signal transmission. RoHS compliant and UL certified, this connector guarantees quality and reliability.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
| TE Connectivity 2007747-1 | ![]() | |
| TE Connectivity 2007781-1 | ![]() | |
| TE Connectivity 2007782-2 | ![]() | |
| TE Connectivity 2007783-1 | ![]() | |
| TE Connectivity 2007789-1 | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 03/23/2025 | PCN-25-232460 - Manufacturing location change. We plan to outsource some TE existing assembly lines (i.e. transfer existing assembly lines to TE s suppliers). Target transfer schedule to be finished by the end of Feb 2025. | Download | |||







