1747418-2

Heilind Number:AMP1747418-2
Manufacturer:TE Connectivity
Manufacturer Number:1747418-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

DYNAMIC D4200 REC CONT M

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1747418-2
Series:Dynamic 4000 Series
Amperage:24 A
Termination Method:Crimp
Contact Material:Copper Alloy
Contact Plating:Gold
Overall Length:17.1 mm, .673 in
Voltage:600 V AC, 600 V DC
Contact Type:Socket
Package Quantity:2000
Cable Type:Discrete Wire, Stranded
GPL:440
Packaging:Reel
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:15 µin, .38 µm
Contact Underplating Material:Nickel
Sealable:No
GPL Description:Industrial
Connector and Contact Terminate To:Wire & Cable
Product Code:K621
Wire Size:14 - 16 AWG, 1.23 - 2.27 mm²
Contact Transmits:Power
Connector System:Wire to Wire
ECCN:EAR99
Contact Underplating Thickness:1.3 µm, 51.18 µin
Barrel Type:Open
Accepts Wire Insulation Diameter:.079 - .148 in, 2 - 3.75 mm
Contact Retention:With
Contact Retention Type:Locking Lance
Glow Wire Rating:Standard Part - Not Glow Wire
Wire Range Mark:M
Part Aliases:1747418-2
SKU:AMP1747418-2

Detailed Description

Introducing the Dynamic D4200 REC CONT M, a high-performance socket contact designed for industrial applications. With a current rating of 24 A and a voltage capacity of 600 V AC/DC, this contact ensures reliable power transmission in demanding environments. Featuring a gold-plated copper alloy construction, it offers excellent conductivity and corrosion resistance. The crimp termination method allows for secure and easy installation on 14-16 AWG wires. With a contact retention mechanism and operating temperature range of -55 to 105°C, this contact guarantees long-term durability and performance. RoHS compliant and available in a package of 2000 on a reel, the D4200 is the ideal solution for wire-to-wire connector systems in a wide range of industrial applications.