1410187-4

Heilind Number:	AMP1410187-4
Manufacturer:	TE Connectivity
Manufacturer Number:	1410187-4
Datasheet:	2D Model (DXF)
ECAD Model:

Description:

MULTIGIG RT T2 7RW DC DF CT

More >>

Specifications

Attribute	Value
Product Category:	Backplane Connectors & Accessories Backplane Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 1410187-4
Series:	MULTIGIG RT 2
Amperage:	1 A
Gender:	Plug
Number of Contacts:	112
Number of Rows:	7
Mount Type:	Board Mount
Body Orientation:	Right Angle
Pitch:	.071 in, 1.8 mm
Row Spacing:	.053 mm, 1.35 in
Number of Positions:	112
Mount Orientation:	Right Angle
GPL:	B54
Operating Temperature Range:	-55 - 105 °C, -67 - 221 °F
Circuit Application:	Power & Signal
Mating Alignment:	With
Mating Alignment Type:	Polarization
GPL Description:	Aerospace Defense & Marine
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	F029
Number of Columns:	16
Connector System:	Board to Board
Board to Board Configuration:	Right Angle
Shroud Type:	Fully
Card Slot Centerline:	20.3 mm, .8 in
Guide Location:	Center
Part Aliases:	1410187-4
SKU:	AMP1410187-4

Detailed Description

Introducing the MULTIGIG RT T2 7RW DC DF CT board-to-board connector, featuring a robust design for reliable power and signal transmission in demanding environments. With 112 contacts arranged in 7 rows, this connector offers high-density connectivity with a low-profile right-angle mount orientation. Operating efficiently in temperatures ranging from -55 to 105°C, it is ideal for aerospace, defense, and marine applications. Fully shrouded and RoHS compliant, this connector ensures secure and environmentally friendly board-to-board connections. Trust in the MULTIGIG RT T2 7RW DC DF CT for high-performance and durable interconnect solutions.

Frequently Bought Together

Product	Part #	Description	Stock
	TE Connectivity 1410189-4	MULTIGIG RT T2 7RW H-LFT,ET2

Product Change Notice

Effective Date	Description of Change	Download
11/17/2025	P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.	Download
08/08/2025	P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues.	Download
07/01/2024	P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process	Download
04/17/2017	P-17-014050 - Manufacturing location change. Following Part Numbers will be transferred from outside supplier to TE Connectivity manufacturing location in Mt.Joy, Pennsylvania.	Download
05/30/2014	E-14-007078 - Product Improvement. The EYE OF NEEDLE Tin-Lead Plating change from Sn93-Pb7 To Sn60-Pb40 for TE parts 1410186-3, 1410187-5, 1410189-5, 1410140-3, 1410142-3. There is nothing change on these parts 1410140-1, 1410140-2, 1410142-1, 1410186-1, 1410187-1, 1410187-3, 1410189-3, 1410189-4.	Download