1-66361-4

Heilind Number:AMP1-66361-4
Manufacturer:TE Connectivity
Manufacturer Number:1-66361-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

III+ PIN,18-14,30AU/FL,LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-66361-4
Series:AMP Type III+
Accessory Type:Contact
Termination Method:Crimp
Contact Material:Copper Nickel Alloy
Contact Size:16
Contact Type:Pin
Package Quantity:1000
Cable Type:Discrete Wire
Contact Amperage:25 A
Termination Type:Crimp
GPL:230
Packaging:Carton, Loose Piece
Operating Temperature Range:-55 - 150 °C, -67 - 302 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Contact Termination Plating Thickness:.12 - .2 µm, 5 - 8 µin
Contact Underplating Material:Nickel
GPL Description:Industrial
Connector and Contact Terminate To:Wire & Cable
Product Code:5023
Wire Size:14 - 18 AWG, .8 - 2 mm²
Contact Termination Plating:Gold
ECCN:EAR99
Contact Underplating Thickness:1.27 µm, 50 µin
Wire Insulation Support:With
Accepts Wire Insulation Diameter:.08 - .1 in, 2.03 - 2.54 mm
Test Current:25 A
Color Code:Violet
Contact Product Type:Contact
Mating Pin Diameter:.062 in, 1.57 mm
Part Aliases:1-66361-4
SKU:AMP1-66361-4

Detailed Description

III+ PIN,18-14,30AU/FL,LP is a high-performance contact designed for power and signal applications in industrial settings. With a contact amperage of 25 A, this gold-plated contact ensures reliable conductivity and signal transmission. Its copper-nickel alloy construction and nickel underplating offer excellent durability and corrosion resistance, making it ideal for harsh environments. Termination is quick and easy with the crimp method, suitable for .8 - 2 mm² (14-18 AWG) wire sizes. Each package contains 1000 loose pieces, meeting high-volume production needs. This contact is RoHS compliant, featuring a violet color code for easy identification. Trust the AMP Type III+ contact for secure and efficient wire connections in your applications.