| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions AMC55DRSD-S328 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 110 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | DIP, Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 110 |
| Tail Length: | .19 in, 4.83 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 3 A |
| Termination Plating: | Gold |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Wall Mount |
| SKU: | SULAMC55DRSD-S328 |
AMC55DRSD-S328
| ICC Number: | SULAMC55DRSD-S328 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | AMC55DRSD-S328 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the AMC55DRSD-S328, a high-performance board-to-board PCB connector designed for demanding applications. This connector features a pitch of 2.54mm (.1in) and a voltage rating of 700VAC, making it ideal for power and signal transmission. With a current rating of 3A and gold contact plating, it ensures reliable conductivity even in harsh environments. The beryllium copper contact material and loop bellow design offer superior durability and signal integrity. With 110 positions and a straight orientation, it allows for easy and secure connections on your PCB. Its clearance hole mount type and thru-hole termination method provide added stability and ease of installation. Operating in a wide temperature range from -65 to 150°C, this connector is suitable for use in various industries. Trust the AMC55DRSD-S328 for high-reliability board-to-board connections in your applications.
