| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACM10DTBZ-S664 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.156 in |
| Voltage: | 950 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 20 |
| Tail Length: | .18 in, 4.57 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 11.94 mm, .47 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 950 VAC |
| Card Thickness: | 0.125 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole, Wall Mount |
| SKU: | SULACM10DTBZ-S664 |
ACM10DTBZ-S664
| ICC Number: | SULACM10DTBZ-S664 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACM10DTBZ-S664 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACM10DTBZ-S664, a high-performance board-to-board PCB connector designed for critical applications. Featuring a rugged construction of PPS and beryllium copper, this female connector ensures reliable power and signal transmission in demanding environments. With a spacious 3.96mm pitch and 950VAC voltage rating, it accommodates high-power requirements with ease. The right-angle, side-hole mount type offers versatile installation options, while the gold-plated loop bellow contacts guarantee low contact resistance and enhanced durability. With 20 positions and a 3A amperage, this connector is ideal for high-density applications. Its matte tin termination plating and wide operating temperature range of -65 to 150°C ensure dependable performance in harsh conditions. Trust the ACM10DTBZ-S664 for secure and efficient board-to-board connectivity in mission-critical systems.
