| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC70DKEH-S1243 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 140 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Cantilever |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 140 |
| Tail Length: | .18 in, 4.57 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 13.97 mm, .55 in |
| Connector Width: | 10.16 mm, .4 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole |
| SKU: | SULACC70DKEH-S1243 |
ACC70DKEH-S1243
| ICC Number: | SULACC70DKEH-S1243 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC70DKEH-S1243 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC70DKEH-S1243, a high-performance board-to-board PCB connector designed for demanding applications. With a pitch of 2.54mm (.1 in) and featuring two rows of contacts, this female connector ensures reliable connectivity in tight spaces. Constructed of PPS and beryllium copper with gold contact plating, it offers excellent durability and signal integrity, even in harsh environments. Rated for 700VAC and 3A, it meets the needs of power and signal transmission. The right-angle orientation and clearance hole mount type make it versatile for various PCB layouts. With a termination method of thru hole and 140 positions, it facilitates efficient installation. Operating temperature range of -65 to 150°C ensures performance in extreme conditions. Trust the ACC70DKEH-S1243 for secure and efficient board-to-board connectivity in your applications.
