| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC70DKDH-S1191 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 140 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | DIP, Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Cantilever |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 140 |
| Tail Length: | .16 in, 4.06 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 10.16 mm, .4 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.093 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| SKU: | SULACC70DKDH-S1191 |
ACC70DKDH-S1191
| ICC Number: | SULACC70DKDH-S1191 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC70DKDH-S1191 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC70DKDH-S1191, a high-performance board-to-board PCB connector designed for demanding applications. Featuring a rugged construction of PPS and beryllium copper, this female connector ensures reliable power and signal transmission in harsh environments. With a pitch of 2.54mm and a voltage rating of 700VAC, it is suitable for a wide range of industrial and commercial systems. The cantilever contact type and gold plating guarantee low contact resistance and high durability, while the straight orientation and clearance hole mount type offer easy installation. With 140 positions and a current rating of 3A, this connector provides ample connectivity for your project. Operating efficiently in temperatures ranging from -65 to 150°C, it is ideal for use in extreme conditions. Trust the ACC70DKDHS1191 for secure and efficient board-to-board connections in your application.
