| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC55DRSZ-S664 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 110 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | DIP, Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 110 |
| Tail Length: | .19 in, 4.83 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 11.94 mm, .47 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.125 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole, Wall Mount |
| SKU: | SULACC55DRSZ-S664 |
ACC55DRSZ-S664
| ICC Number: | SULACC55DRSZ-S664 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC55DRSZ-S664 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC55DRSZS664, a high-performance board-to-board PCB connector designed for demanding applications. With a rugged construction featuring PPS and Beryllium Copper materials, this connector ensures reliable connectivity in harsh environments. Boasting a voltage rating of 700 VAC and a current handling capacity of 3 A, it meets the needs of power-intensive systems. The gold-plated contact surfaces guarantee low contact resistance and high signal integrity, while the matte tin termination plating offers excellent solderability. With a compact design, 2.54 mm pitch, and 110 positions, the ACC55DRSZS664 is ideal for space-constrained layouts. Whether used in industrial machinery, telecommunications equipment, or aerospace systems, this connector delivers uncompromising performance. Trust the ACC55DRSZS664 for secure and efficient board-to-board connections in your critical applications.
