| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC55DPUN |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 110 |
| Number of Rows: | 2 |
| Mount Type: | No Mounting |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Double Point |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 110 |
| Tail Length: | .25 in, 6.35 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 14.22 mm, .56 in |
| Connector Width: | 10.16 mm, .4 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| SKU: | SULACC55DPUN |
ACC55DPUN
| ICC Number: | SULACC55DPUN |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC55DPUN |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC55DPUN, a high-performance board-to-board PCB connector designed for critical applications. This female connector features a durable construction with PPS and Beryllium Copper materials, ensuring reliable operation in demanding environments. With a pitch of 2.54mm and a voltage rating of 700VAC, it offers excellent connectivity for power and signal transmission. The right-angle orientation and double-point contact type make it ideal for space-constrained installations, providing secure and efficient connections. With a termination method of thru hole and matte tin plating, this connector guarantees easy and reliable soldering for a total of 110 positions. Its wide operating temperature range of -65 to 150°C further enhances its versatility, making it suitable for a variety of industries. Trust in the ACC55DPUN for seamless and dependable board-to-board connections in your applications.
