| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC55DKNS-S1243 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 110 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Cantilever |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straddle |
| Number of Positions: | 110 |
| Tail Length: | 15.37 mm, .605 in |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 13.97 mm, .55 in |
| Connector Width: | 10.16 mm, .4 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Type: | Straddle Mount, Through Hole |
| SKU: | SULACC55DKNS-S1243 |
ACC55DKNS-S1243
| ICC Number: | SULACC55DKNS-S1243 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC55DKNS-S1243 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC55DKNSS1243, a high-performance board-to-board PCB connector designed for demanding applications. With a pitch of 2.54mm and two rows of contacts, this female connector offers reliable connectivity in a compact .4-inch wide housing. Constructed from PPS and beryllium copper with gold contact plating, it ensures excellent conductivity and durability, even in harsh environments. Rated for 700VAC and 3A, it meets stringent safety and performance standards. The side hole mount type and straddle orientation make it versatile for various board layouts. Featuring a cantilever contact design and matte tin termination plating, it guarantees secure and stable connections over time. With a wide operating temperature range of -65 to 150°C, this connector is suitable for use in diverse industries, from telecommunications to aerospace. Trust the ACC55DKNSS1243 for seamless and dependable board-to-board connections in your critical applications.
