| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC35DTMZ-S664 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 70 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 70 |
| Tail Length: | .25 in, 6.35 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 11.94 mm, .47 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.125 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole, Wall Mount |
| SKU: | SULACC35DTMZ-S664 |
ACC35DTMZ-S664
| ICC Number: | SULACC35DTMZ-S664 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC35DTMZ-S664 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC35DTMZ-S664, a high-performance board-to-board PCB connector designed for demanding applications. Featuring a rugged construction of PPS and Beryllium Copper, this female connector ensures reliable power and signal transmission in harsh environments. With a wide operating temperature range of -65 to 150 °C and a voltage rating of 700 VAC, it is suitable for a variety of industrial and commercial systems. Gold contact plating and a loop bellow design guarantee excellent conductivity and signal integrity, while matte tin termination plating offers enhanced durability. With 70 positions and a pitch of 2.54 mm, this right-angle connector provides efficient and space-saving connectivity on printed circuit boards. Trust the ACC35DTMZS664 for secure and high-speed data transfer in your electronic designs.
