| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC17DTBS-S189 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 34 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 34 |
| Tail Length: | .18 in, 4.57 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole |
| SKU: | SULACC17DTBS-S189 |
ACC17DTBS-S189
| ICC Number: | SULACC17DTBS-S189 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC17DTBS-S189 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC17DTBS-S189, a high-quality board-to-board PCB connector designed for demanding applications. Constructed with PPS and Beryllium Copper materials, this female connector ensures reliable performance in extreme conditions. With a pitch of 2.54mm (.1 in) and two rows of 34 positions, it offers ample connectivity options. Rated for 700VAC and 3A, it guarantees safe and efficient power transmission. The right-angle, side hole mount type with a tail length of .18in (4.57mm) allows for easy installation in tight spaces. Featuring gold contact plating and matte tin termination, this connector ensures excellent conductivity and corrosion resistance. Suitable for a wide range of industries, it operates flawlessly in temperatures ranging from -65 to 150°C. Upgrade your electronic systems with the ACC17DTBS-S189 for reliable and high-performance connectivity.
