| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC13DREH |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 26 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | Eyelet |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Full Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 26 |
| Tail Length: | .225 in, 5.72 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 10.95 mm, .431 in |
| Connector Width: | .33 in, 8.38 mm |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| SKU: | SULACC13DREH |
ACC13DREH
| ICC Number: | SULACC13DREH |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC13DREH |
| ECAD Model: |
Specifications
Detailed Description
The ACC13DREH is a high-performance board-to-board PCB connector designed for demanding applications. With a pitch of 2.54mm, it offers reliable connectivity in tight spaces. Featuring PPS and beryllium copper construction, it ensures excellent durability and signal integrity. This female connector has a voltage rating of 700 VAC and can handle up to 3A of current, making it suitable for power and signal transmission. The clearance hole mount type and straight orientation allow for easy installation on PCBs. With a full bellow contact design and gold plating, it guarantees low contact resistance and superior signal transmission. The 26-position connector is terminated via eyelets and is plated with matte tin for added reliability. Operating in a wide temperature range of -65 to 150°C, it is suitable for harsh environments. The ACC13DREH is a top choice for applications requiring high reliability and performance in board-to-board connectivity.
