| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC08DTMI-S189 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 16 |
| Number of Rows: | 2 |
| Mount Type: | Threaded |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 16 |
| Tail Length: | .25 in, 6.35 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Screw Mount |
| SKU: | SULACC08DTMI-S189 |
ACC08DTMI-S189
| ICC Number: | SULACC08DTMI-S189 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC08DTMI-S189 |
| ECAD Model: |
Specifications
Detailed Description
ACC08DTMI-S189. This female connector, crafted from a robust combination of PPS and Beryllium Copper, boasts a pitch of 2.54mm (.1 in) and is designed for high-voltage applications, with a rating of 700 VAC and an amperage of 3A. Featuring a threaded mount type for secure installation and a right-angle orientation, it offers versatility in connectivity. The .25-inch (6.35mm) tail length and Loop Bellow contact type ensure reliable signal transmission. With two rows and 16 positions, it provides ample connectivity options. Gold contact plating guarantees excellent conductivity, while the connector's durable construction, including a Beryllium Copper contact material and matte tin termination plating, ensures long-term performance even in harsh environments. Operating in a wide temperature range from -65 to 150°C, this connector is ideal for various hi-rel board-to-board and card edge applications.
