| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACC08DTMH-S189 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 16 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 16 |
| Tail Length: | .25 in, 6.35 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole |
| SKU: | SULACC08DTMH-S189 |
ACC08DTMH-S189
| ICC Number: | SULACC08DTMH-S189 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACC08DTMH-S189 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ACC08DTMHS189, a high-performance board-to-board PCB connector designed for demanding applications. Crafted with precision, this connector features a pitch of 2.54mm and a voltage rating of 700VAC, making it ideal for power and signal transmission. With a durable construction of PPS and Beryllium Copper, it offers reliable connectivity in harsh environments. The right-angle orientation and clearance hole mount type allow for easy installation in tight spaces. Gold contact plating ensures low contact resistance and enhanced signal integrity, while matte tin termination plating offers excellent solderability. With 16 positions and a current rating of 3A, this connector is suitable for a wide range of industrial and commercial projects. Trust the ACC08DTMHS189 for secure and efficient board-to-board connections in your application.
