| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ACB50DYFD |
| Amperage: | 1 A |
| Gender: | Female |
| Number of Contacts: | 100 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.05 in |
| Voltage: | 300 VAC |
| Contact Type: | Cantilever |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 100 |
| Tail Length: | .1 in, 2.54 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 1 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 300 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Surface Mount, Wall Mount |
| SKU: | SULACB50DYFD |
ACB50DYFD
| ICC Number: | SULACB50DYFD |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ACB50DYFD |
| ECAD Model: |
Specifications
Detailed Description
ACB50DYFD. This PPS & Beryllium Copper board-to-board connector, featuring a pitch of 1.27mm (.05 inches), is designed for high-performance applications. With a female gender and a voltage rating of 300 VAC, it offers reliable power and signal transmission. The cantilever contact type ensures secure connections, while the gold contact plating enhances conductivity. With a low profile of just 15.49mm (.61 inches) and a straight orientation, it is ideal for space-restricted installations. The surface mount termination method and matte tin termination plating make it easy to integrate into your PCB assembly process. Operating in a wide temperature range from -65 to 150°C, this connector is suitable for use in harsh environments. With 100 positions and dual rows, it provides ample connectivity in your electronic systems. Trust in the ACB50DYFD for dependable performance in your high-reliability applications.
