| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ABM06DRMD-S273 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 12 |
| Number of Rows: | 2 |
| Mount Type: | Clearance Hole |
| Termination Method: | Wire Wrap |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.156 in |
| Voltage: | 950 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 12 |
| Tail Length: | 14.22 mm, .56 in |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 950 VAC |
| Card Thickness: | 0.093 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Wall Mount |
| SKU: | SULABM06DRMD-S273 |
ABM06DRMD-S273
Specifications
Detailed Description
Introducing the ABM06DRMD-S273, a high-performance board-to-board PCB connector designed for critical applications. Engineered with precision, this connector features a pitch of 3.96mm and is crafted from PPS and Beryllium Copper for exceptional durability. With a voltage rating of 950 VAC and an amperage of 3A, it ensures reliable power transmission. The clearance hole mount type and straight orientation make for easy installation, while the gold contact plating guarantees superior conductivity. Boasting a low profile design with a connector height of just 15.49mm, it is ideal for space-restricted setups. Rated for operation in harsh environments with a wide temperature range of -65 to 150°C, this connector is a dependable choice for your connectivity needs. With 12 positions and 2 rows, it offers ample connectivity options, while the loop bellow contact type and wire wrap termination method ensure secure and stable connections. Trust in the ABM06DRMD-S273 for seamless board-to-board connectivity in your applications.

