| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ABC70DKMS-S1191 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 140 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | Wire Wrap |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Cantilever |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straight |
| Number of Positions: | 140 |
| Tail Length: | 14.22 mm, .56 in |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 10.16 mm, .4 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.093 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| SKU: | SULABC70DKMS-S1191 |
ABC70DKMS-S1191
| ICC Number: | SULABC70DKMS-S1191 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ABC70DKMS-S1191 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ABC70DKMS-S1191, a high-performance board-to-board PCB connector designed for demanding applications. This female connector features a pitch of 2.54mm (.1 in) and is rated for up to 700VAC and 3A, making it ideal for power and signal transmission. With a durable construction of PPS and Beryllium Copper, it ensures reliable performance even in harsh environments. The straight orientation and side hole mount type offer easy installation, while the cantilever contact type provides secure connections. With 140 positions and gold contact plating, this connector guarantees excellent signal integrity. Its wide operating temperature range of -65 to 150°C and matte tin termination plating further enhance its reliability, making it a perfect choice for various industrial applications. Trust the ABC70DKMS-S1191 for seamless connectivity in your projects.
