| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ABC30DTBZ-S273 |
| Amperage: | 3 A |
| Gender: | Female |
| Number of Contacts: | 60 |
| Number of Rows: | 2 |
| Mount Type: | Side Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.1 in |
| Voltage: | 700 VAC |
| Contact Type: | Loop Bellow |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Right Angle |
| Number of Positions: | 60 |
| Tail Length: | .18 in, 4.57 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | 11.94 mm, .47 in |
| Current Rating: | 3 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 700 VAC |
| Card Thickness: | 0.093 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole, Wall Mount |
| SKU: | SULABC30DTBZ-S273 |
ABC30DTBZ-S273
| ICC Number: | SULABC30DTBZ-S273 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ABC30DTBZ-S273 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ABC30DTBZ-S273, a high-performance board-to-board PCB connector designed for demanding applications. This female connector, featuring a pitch of 2.54mm, is crafted from PPS and Beryllium Copper, ensuring exceptional durability and reliability. With a voltage rating of 700 VAC and an amperage of 3A, it meets the stringent power requirements of modern electronic systems. The right-angle, side-hole mount type offers versatility in installation, while the gold contact plating guarantees excellent signal conductivity. Boasting a two-row design and 60 positions, this connector facilitates complex board connections with ease. Its wide operating temperature range of -65 to 150°C, along with matte tin termination plating, ensures performance in harsh environments. Trust the ABC30DTBZ-S273 for secure and efficient board-to-board connectivity in your applications.
