| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Part Number: | Sullins Connector Solutions ABB66DHRN-S621 |
| Amperage: | 1 A |
| Gender: | Female |
| Number of Contacts: | 132 |
| Number of Rows: | 2 |
| Mount Type: | No Mounting |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Pitch: | 0.05 in |
| Voltage: | 300 VAC |
| Contact Type: | Hairpin |
| Insulation Material: | Polyphenylene Sulfide |
| Orientation: | Straddle |
| Number of Positions: | 132 |
| Tail Length: | .16 in, 4.06 mm |
| Operating Temperature Range: | -65 - 150 °C |
| Connector Height: | 15.49 mm, .61 in |
| Connector Width: | .37 in, 9.4 mm |
| Card Type: | MCA |
| Current Rating: | 1 A |
| Termination Plating: | Matte Tin |
| Voltage Rating: | 300 VAC |
| Card Thickness: | 0.062 in |
| Operating Temperature: | -65 to 150 °C |
| Mounting Type: | Straddle Mount |
| SKU: | SULABB66DHRN-S621 |
ABB66DHRN-S621
| ICC Number: | SULABB66DHRN-S621 |
| Manufacturer: | Sullins Connector Solutions |
| Manufacturer Number: | ABB66DHRN-S621 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the ABB66DHRNS621, a high-performance board-to-board PCB connector designed for critical applications in aerospace, defense, and industrial settings. Featuring a rugged construction with PPS and beryllium copper materials, this connector ensures reliable power and signal transmission in harsh environments. With a low-profile design and straddle orientation, it offers seamless integration into tight spaces on PCBs. Gold contact plating guarantees excellent conductivity and corrosion resistance, while matte tin termination plating enhances durability. With 132 positions and a pitch of 1.27mm, it provides ample connectivity for complex systems. Operating in a wide temperature range from -65 to 150°C, this connector is built to withstand extreme conditions. Trust the ABB66DHRNS621 for secure and efficient board-to-board connections in your most demanding applications.
