Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Panduit |
Manufacturer Part Number: | Panduit H200X165H2T |
Color: | Yellow |
Maximum Operating Temperature: | 135 °C, 275 °F |
Minimum Operating Temperature: | -55 °C, -67 °F |
Overall Width: | 2 in, 50.8 mm |
Overall Height: | 1.65 in, 41.9 mm |
Overall Length: | 1.65 in, 41.9 mm |
Material: | Polyolefin |
Sleeve Diameter: | 1 in, 25.4 mm |
Compatible Wire Size: | 18 AWG |
SKU: | PANH200X165H2T |
H200X165H2T
Heilind Number: | PANH200X165H2T |
Manufacturer: | Panduit |
Manufacturer Number: | H200X165H2T |
Datasheet: | Drawing |
ECAD Model: |
Description:
The thermal transfer military grade heat-shrink label in yellow is one-sided with a 1.0" (25.4 mm) diameter and made of 3:1 flattened polyolefin. It is 2.0" wide and 1.65" high (50.8 x 41.9 mm). The heat-shrink sleeve is designed to provide a clear, reliable, and durable way to identify wires and cables. The sleeve has 1 label per row and 250 labels per roll. Heat-shrink labels are mounted on a plastic carrier and offer crisp, clear legends with superior readability for quick and easy label production in all label formats, including thermal transfer and dot matrix printable.
More >>Specifications
Detailed Description
The H200X165H2T is a military-grade heat-shrink label designed for reliable wire and cable identification. With a vibrant yellow color, this 2.0" wide by 1.65" high sleeve is easily visible in any application. Constructed from durable 3:1 flattened polyolefin, it offers superior performance in harsh environments, with a wide operating temperature range from -55 °C to 135 °C (-67 °F to 275 °F). Each label features a crisp, clear legend for easy readability, perfect for quick and accurate label production. RoHS compliant and compatible with 18 AWG wire, this sleeve is a versatile and essential tool for any project requiring high-quality cable marking. With 250 labels per roll, it ensures efficient and cost-effective labeling, making it an ideal choice for military, aerospace, and other high-reliability applications.
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