95503-6891
Modular Jack, Vertical, Top Entry, Surface Mount, 8/8, Low Profile, Tube
Part Aliases: Molex 0955036891
The 95503-6891 is a high-performance Modular Jack designed for vertical, top entry, surface mount applications. Featuring 8/8 configuration, this low profile RJ45 connector is housed in a durable black High Temperature Thermoplastic body, ensuring reliable operation in harsh environments. With a current rating of 1.5 A and a voltage of 125 V DC, it is suitable for a wide range of power and signal applications. The contact material is Copper Alloy with Gold over Palladium Nickel plating, offering excellent conductivity and corrosion resistance. With straight body orientation and PCB locator and retention features, this connector ensures easy and secure installation on a 1.57 mm thick PCB. With UL certification and RoHS compliance, the 95503-6891 meets industry standards for safety and environmental responsibility, making it the ideal choice for demanding connectivity solutions.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 95503-6891 |
| Color: | Black |
| Series: | 95503 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Surface Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Over Palladium Nickel |
| Body Orientation: | Straight |
| Pitch: | 1.02 mm |
| Voltage: | 125 V DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Jack |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold over Palladium Nickel |
| Contact Mating Area Plating Thickness: | .051 µm, 1.016 µm |
| Mating Cycles: | 2500 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 1.905 µm |
| PCB Thickness (Recommended): | 1.57 mm |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 1.27 mm |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0955036891 |
| SKU: | MOL95503-6891 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/17/2022 | 511024 - Change Supplier. Adding Alternate sourcing for the terminal copper strip of modular jack as the existing source has decided manufacturing impacted material. the alternate source will support with better lead time and delivery. this will be a running change and required internal qualification will be done before implementation date. | Download |
| 03/30/2022 | 511458 - Change to Product. Optimize the tolerance and dimensions for SD drawings of impacted part numbers dont have any changes on the physical product. no impact to customer assembly product fit or function. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |