95503-2441

Heilind Number:MOL95503-2441
Manufacturer:Molex
Manufacturer Number:95503-2441
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Modular Jack, Vertical, Top Entry, Through Hole, 4/4, No Key Version, Tray

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 95503-2441
Color:Black
Series:95503 - Modular Jack 4/4
Amperage:1.5 A
Connector Type:Modular Jack 4/4
Gender:Female
Mount Type:Surface Mount
Termination Method:Through Hole
Contact Material:Copper Alloy
Contact Plating:Gold Over Palladium Nickel
Body Orientation:Straight
Pitch:1.02 mm
Voltage:125 V DC
Material:High Temperature Thermoplastic
Number of Ports:1
Orientation:Vertical
Keying:No
Component Type:PCB Jack
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold over Palladium Nickel
Contact Mating Area Plating Thickness:.051 µm, 1.016 µm
Mating Cycles:2500
PCB Locator:Yes
PCB Retention:Yes
Contact Termination Plating Thickness:1.905 µm
PCB Thickness (Recommended):1.57 mm
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):005
Max. Cycles at Max. Process Temperature:001
Termination Pitch:1.27 mm
Surface Mount Compatible:Yes
Waterproof Dustproof:No
Non Magnetic:Yes
Material Flammability Standard:94V-0
Part Aliases:0955032441
SKU:MOL95503-2441

Detailed Description

The 95503-2441 is a black Vertical Top Entry Modular Jack, featuring 4/4 configuration with a No Key Version. Designed for through hole mounting, this female connector has a current rating of 1.5 A and is suitable for use with 125 V DC. Constructed with a High Temperature Thermoplastic body and Copper Alloy contacts plated with Gold over Palladium Nickel, it offers excellent durability and conductivity. With a straight body orientation, it is ideal for PCB applications, with UL agency certification and RoHS compliance. The termination method is through hole, with a pitch of 1.02 mm and termination pitch of 1.27 mm, making it surface mount compatible. It has a mating cycle of 2500 and is lead-free wave solder compatible, ensuring reliable performance in various applications.