76015-5403

ICC Number:MOL76015-5403
Manufacturer:Molex
Manufacturer Number:76015-5403
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

GbX I-Trac Vertical Header Module, 1.85mm by 3.70mm Pitch, Right Guide, Left Open, 7 Rows, 4 Columns, 56 Circuits, Mating Pin Length 4.70mm, Lead-Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 76015-5403
Color:Black
Series:76015 - GbX I-Trac
Amperage:1 A
Connector Type:GbX I-Trac
Number of Contacts:56
Number of Rows:7
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Contact Plating:Gold
Maximum Operating Temperature:85 °C
Pitch:1.85 mm, 3.7 mm
Voltage:120 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Component Type:PCB Header
Number of Pairs:4-pair, Open Pin Field
Data Rate:12 Gb/s
Tail Length:2.1 mm
Operating Temperature Range:85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:56
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:.762 µm
PCB Thickness (Recommended):1.6 mm
Number of Columns:4
Contact Termination Plating:Tin
Termination Pitch:1 mm, 2.7 mm
Guide to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Board to Board Configuration:Backplane, Midplane, Orthogonal
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0760155403
SKU:MOL76015-5403

Detailed Description

The GbX I-Trac Vertical Header Module ( 76015-5403) offers high-speed connectivity with a pitch of 1.85mm by 3.70mm. Featuring 7 rows and 4 columns, this black module has 56 gold-plated contacts, suitable for 4-pair data transmission at 12 Gb/s. Constructed with a high-temperature thermoplastic housing and high-performance alloy contacts, it ensures reliable performance in demanding environments. With a mating pin length of 4.70mm and through-hole termination, it provides secure connections on PCBs. RoHS compliant and rated for 200 mating cycles, this component is ideal for backplane, orthogonal, and midplane configurations in various electronic applications.