56579-0576
Mini USB, AB-Receptacle, Right-Angle, Surface Mount Solder Tails and Shell Tabs, with Cover Tape, Lead-Free
Part Aliases: Molex 0565790576
The 56579-0576, a high-speed Mini USB connector designed for On-The-Go (OTG) applications. This female connector features a right-angle, surface mount design with solder tails and shell tabs for secure PCB attachment. With a compact .8mm pitch and 5 gold-plated contacts, it ensures reliable data and power transmission at up to 30V and 1A. Constructed with a thermoplastic housing and full shield for durability and EMI protection, this connector operates flawlessly in a wide temperature range from -20 to 85°C. RoHS compliant and lead-free, it's suitable for various electronic devices, offering secure and efficient connectivity in demanding environments. Trust the 56579-0576 for high-performance USB OTG connections in your next design project.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 56579-0576 |
Color: | Gray |
Series: | 56579 - USB 2.0 - USB OTG (On-The-Go) |
Amperage: | 1 A |
Connector Type: | USB, USB OTG (On-The-Go) |
Gender: | Female |
Number of Contacts: | 5 |
Number of Rows: | 1 |
Termination Method: | Surface Mount |
Contact Material: | High Performance Alloy (HPA), Phosphor Bronze |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -20 °C |
Body Orientation: | Right Angle |
Pitch: | 8 mm |
Voltage: | 30 V AC/DC |
Shield Type: | Full Shield |
Material: | Thermoplastic |
Number of Ports: | 1 |
Orientation: | Right Angle |
USB Type: | Mini-AB (OTG) |
Component Type: | Receptacle |
Operating Temperature Range: | -20 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 5 |
PCB Locator: | No |
Shielded: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 1.016 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | .8 mm |
Supplier Product Group: | High Speed Cage & Connector Assemblies |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 250 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 003 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | .8 mm |
Lock to Mating Part: | Yes |
Surface Mount Compatible: | Yes |
Waterproof Dustproof: | No |
Part Aliases: | 0565790576 |
SKU: | MOL56579-0576 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |