Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 50394-8200 |
Series: | 50394 - Milli-Grid |
Connector Type: | Milli-Grid |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper Alloy |
Contact Plating: | Nickel |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Contact Termination Plating Thickness: | 2.032 µm |
Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
Connector System: | Wire to Board, Wire to Wire |
Contact Termination Plating: | Nickel |
Wire Insulation Diameter: | 1.4 mm |
Part Aliases: | 0503948200 |
SKU: | MOL50394-8200 |
50394-8200
Heilind Number: | MOL50394-8200 |
Manufacturer: | Molex |
Manufacturer Number: | 50394-8200 |
Datasheet: | Product Specification |
ECAD Model: |
Specifications
Detailed Description
Introducing the 50394-8200, a high-performance Milli-Grid Crimp Terminal designed for seamless connectivity in your electronic applications. This female terminal, featuring a contact material of durable Copper Alloy with Nickel plating, ensures reliable signal transmission. Its versatile termination method allows for easy crimping or compression onto wires ranging from 24 to 30 AWG, accommodating various project requirements. With a gold-plated contact mating area, it guarantees excellent conductivity and signal integrity. Measuring at a termination plating thickness of 2.032 µm, this terminal offers robust and long-lasting performance. RoHS compliant and in stock for immediate shipping, the 50394-8200 is the perfect choice for your wire-to-wire or wire-to-board connector needs. Elevate your connectivity solutions with this premium Milli-Grid Connector System component.
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