50394-8100
Milli-Grid Crimp Terminal, Female, 0.38
Part Aliases: Molex 0503948100
The 50394-8100 is a versatile Milli-Grid Crimp Terminal designed for reliable female connections in electronic applications. With a contact rating of 0.38, this terminal is part of the high-performance 50394 Milli-Grid series, offering exceptional signal integrity. Constructed from durable copper alloy with nickel plating, it ensures both conductivity and corrosion resistance. Each terminal is individually packaged in a convenient bag for easy handling. Suitable for wire sizes ranging from 24 to 30 AWG, it accommodates various connection needs in wire-to-wire or wire-to-board setups. With gold plating in the contact mating area and nickel plating on the termination, it guarantees stable and low-resistance connections. Additionally, it is RoHS compliant, making it a reliable and environmentally friendly choice for your connectivity needs.
Details
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8100 |
| Series: | 50394 - Milli-Grid |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948100 |
| SKU: | MOL50394-8100 |
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Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |