| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8100 |
| Series: | 50394 - Milli-Grid |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948100 |
| SKU: | MOL50394-8100 |
50394-8100
Specifications
Detailed Description
The 50394-8100 is a versatile Milli-Grid Crimp Terminal designed for reliable female connections in electronic applications. With a contact rating of 0.38, this terminal is part of the high-performance 50394 Milli-Grid series, offering exceptional signal integrity. Constructed from durable copper alloy with nickel plating, it ensures both conductivity and corrosion resistance. Each terminal is individually packaged in a convenient bag for easy handling. Suitable for wire sizes ranging from 24 to 30 AWG, it accommodates various connection needs in wire-to-wire or wire-to-board setups. With gold plating in the contact mating area and nickel plating on the termination, it guarantees stable and low-resistance connections. Additionally, it is RoHS compliant, making it a reliable and environmentally friendly choice for your connectivity needs.
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 | Molex 51021-0200 | 1.25mm Pitch PicoBlade Wire-to-Wire and Wire-to-Board Housing, Female, 2 Circuits, Natural | |
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 | Molex 51110-0860 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 8 Circuits, without Center Polarization Key, with Locking Ramp, Lead-Free | |
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Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download | |||
Availability
Immediate Shipment:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 50394-8100 |
| Other Names: | 0503948100 |
