| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8051 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948051 |
| SKU: | MOL50394-8051 |
50394-8051
Specifications
Detailed Description
Introducing the 50394-8051 Milli-Grid Crimp Terminal, a high-performance female connector designed for precise and reliable signal transmission. With a current rating ranging from .5 A to 2 A at 125 V, this terminal is suitable for a variety of low-power applications. Constructed with a durable copper alloy contact material and nickel plating, it ensures excellent conductivity and corrosion resistance. The gold-plated contact mating area further enhances signal integrity. Featuring a crimp or compression termination method for easy installation onto 24-30 AWG wires, this connector is perfect for wire-to-wire or wire-to-board connections. RoHS compliant and in stock for immediate availability, the 50394-8051 is the ideal choice for your connectivity needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 39-00-0038 | Mini-Fit Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, Double 22+22 or Single 24-18 AWG, Reel | ![]() |
| Molex 39-00-0046 | Mini-Fit Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, 28-22 AWG, Reel | ![]() |
| Molex 39-01-2020 | Mini-Fit Jr. Receptacle Housing, Dual Row, 2 Circuits, UL 94V-2, Natural | ![]() |
| Molex 39-01-2040 | Mini-Fit Jr. Receptacle Housing, Dual Row, 4 Circuits, UL 94V-2, Natural | ![]() |
| Molex 39-01-2045 | Mini-Fit Jr. Receptacle Housing, Dual Row, 4 Circuits, UL 94V-0, Natural | ![]() |
| Molex 39-01-4031 | Mini-Fit Jr. Receptacle Housing, Single Row, 3 Circuits, UL 94V-0, Natural | ![]() |
| Molex 43025-0400 | Micro-Fit 3.0 Receptacle Housing, Dual Row, 4 Circuits, UL 94V-0, Low-Halogen, Black | ![]() |
| Molex 43025-1200 | Micro-Fit 3.0 Receptacle Housing, Dual Row, 12 Circuits, UL 94V-0, Black | ![]() |
| Molex 43645-0400 | Micro-Fit 3.0 Receptacle Housing, Single Row, 4 Circuits, UL 94V-0, Black | ![]() |
| Molex 50-57-9402 | SL Crimp Housing, Single Row, Version G, Positive Latch, 2 Circuits, Black | ![]() |
| Molex 50-57-9404 | SL Crimp Housing, Single Row, Version G, Positive Latch, 4 Circuits, Black | ![]() |
| Molex 51110-0850 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 8 Circuits, without Center Polarization Key, without Locking Ramp, Lead-Free | ![]() |
| Molex 51110-0856 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 8 Circuits, with Center Locking Ramp and Side Polarization Keys, Lead-Free | ![]() |
| Molex 51110-1051 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 10 Circuits, with Center Polarization Key, without Locking Ramp, Lead-Free | ![]() |
| Molex 51110-1060 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 10 Circuits, without Center Polarization Key, with Locking Ramp, Lead-Free | ![]() |
| Molex 51110-1256 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 12 Circuits, with Center Locking Ramp and Side Polarization Keys, Lead-Free | ![]() |
| Molex 51110-1451 | 2.00mm Pitch, Milli-Grid Receptacle Housing, 14 Circuits, with Center Polarization Key, with Locking Ramp, Lead-Free | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download | |||


