50394-8051
Milli-Grid Crimp Terminal, Female, 0.38
Part Aliases: Molex 0503948051
The 50394-8051 Milli-Grid Crimp Terminal, a high-performance female connector designed for precise and reliable signal transmission. With a current rating ranging from .5 A to 2 A at 125 V, this terminal is suitable for a variety of low-power applications. Constructed with a durable copper alloy contact material and nickel plating, it ensures excellent conductivity and corrosion resistance. The gold-plated contact mating area further enhances signal integrity. Featuring a crimp or compression termination method for easy installation onto 24-30 AWG wires, this connector is perfect for wire-to-wire or wire-to-board connections. RoHS compliant and in stock for immediate availability, the 50394-8051 is the ideal choice for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8051 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948051 |
| SKU: | MOL50394-8051 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |