503175-1110

ICC Number:MOL503175-1110
Manufacturer:Molex
Manufacturer Number:503175-1110
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

1.50mm Pitch, CLIK-Mate PCB Receptacle, Single Row, Through Hole, Right-Angle, Tin Plating, Positive Lock, without Peg, 11 Circuits, Natural

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 503175-1110
Color:Beige
Series:503175 - CLIK-Mate
Amperage:2 A
Connector Type:CLIK-Mate
Number of Contacts:11
Number of Rows:1
Mount Type:Through Hole
Termination Method:Through Hole
Contact Material:Copper Alloy
Maximum Operating Temperature:105 °C
Minimum Operating Temperature:-40 °C
Pitch:1.5 mm
Voltage:100 V
Orientation:Right Angle
Keying:Yes
Operating Temperature Range:-40 - 105 °C
Circuit Application:Signal
Contact Mating Area Plating:Tin
Number of Contacts Loaded:11
Mating Cycles:30
PCB Locator:No
PCB Retention:With
Polarized to PCB:Yes
Polarized to Mate:Yes
PCB Thickness (Recommended):1.6 mm, 2.4 mm
Supplier Product Group:PCB Socket Receptacles
Connector System:Wire to Board
Contact Termination Plating:Tin
Glow Wire Capable:No
Guide to Mating Part:Yes
Lock to Mating Part:Yes
Stackable:No
Part Aliases:5031751110
SKU:MOL503175-1110

Detailed Description

Introducing the Molex CLIK-Mate 503175-1110, a high-performance wire-to-board connector designed for reliable signal transmission in electronic applications. With 11 contacts arranged in a single row, this beige connector features a durable copper alloy construction with tin plating, ensuring excellent conductivity and corrosion resistance. Operating flawlessly in temperatures ranging from -40 to 105 °C, it offers a wide voltage tolerance of 100 V and a low amperage of 2 A. Engineered for through-hole mounting on PCBs with a thickness of 1.6 to 2.4 mm, it includes keying and polarization for easy and secure installation. Ideal for use in various industries, this RoHS-compliant connector is tray-packaged for convenience. Trust the CLIK-Mate 503175-1110 for robust and efficient board-level connections.