502386-0870

ICC Number:MOL502386-0870
Manufacturer:Molex
Manufacturer Number:502386-0870
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

1.25mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Right-Angle, Tin (Sn) Plating, 8 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 502386-0870
Color:Natural
Series:502386 - CLIK-Mate
Amperage:1 A
Connector Type:CLIK-Mate
Number of Contacts:8
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Copper Alloy
Maximum Operating Temperature:105 °C
Minimum Operating Temperature:-40 °C
Pitch:1.25 mm
Voltage:50 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Right Angle
Keying:Yes
Operating Temperature Range:-40 - 105 °C
Circuit Application:Signal
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:1.016 µm
Number of Contacts Loaded:8
Mating Cycles:30
PCB Locator:No
PCB Retention:With
Polarized to PCB:No
Contact Termination Plating Thickness:1.016 µm
Polarized to Mate:Yes
Supplier Product Group:PCB Socket Receptacles
Connector System:Wire to Board
Contact Termination Plating:Tin
Termination Pitch:1.25 mm
Glow Wire Capable:No
Guide to Mating Part:Yes
Lock to Mating Part:Yes
Mated Height:5.55 mm
Stackable:No
Part Aliases:5023860870
SKU:MOL502386-0870

Detailed Description

Introducing the 502386-0870, a high-performance CLIK-Mate Wire-to-Board Connector designed for signal applications. With 8 contacts in a single row, this connector boasts a low 1.25mm pitch, allowing for precise and secure connections. Constructed with a durable high-temperature thermoplastic housing and copper alloy contacts plated with tin, it ensures reliable performance in a wide operating temperature range from -40 to 105°C. Featuring a right-angle orientation and keying for proper alignment, the 502386-0870 offers easy and secure PCB mounting with retention and 1.016µm thick termination plating. With RoHS compliance and a trusted reputation, this connector is ideal for various electronic applications.