501568-0907
1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, Tin Plated, with Inner Positive Lock, 9 Circuits
Part Aliases: Molex 5015680907
The 501568-0907 Pico-Clasp Wire-to-Board Connector, a high-quality solution for your PCB connectivity needs. This right-angle connector, with a natural nylon housing, features 9 tin-plated phosphor bronze contacts for reliable performance. Operating at up to 50V AC/DC and 1A, it is suitable for various applications. With surface mount termination and PCB retention, installation is secure and straightforward. Meeting RoHS compliance and rated for -40 to 105°C, this connector guarantees durability and safety. Whether for industrial or consumer electronics, the Pico-Clasp Connector ensures efficient power and signal transmission in a compact 1mm pitch design. Trust in its 30 mating cycles and secure locking mechanism for long-lasting connectivity in your projects. Available now, this essential component is in stock and ready to ship. Upgrade your PCB designs with the 501568-0907 Pico-Clasp Connector.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 501568-0907 |
| Color: | Natural |
| Series: | 501568 - Pico-Clasp |
| Amperage: | 1 A |
| Connector Type: | Pico-Clasp |
| Number of Contacts: | 9 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 1 mm |
| Voltage: | 50 V AC/DC |
| Material: | Nylon |
| Orientation: | Right Angle |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Number of Contacts Loaded: | 9 |
| Mating Cycles: | 30 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Polarized to Mate: | Yes |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Breakaway: | No |
| Part Aliases: | 5015680907 |
| SKU: | MOL501568-0907 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/28/2023 | 513927 - Change to Product. This notification is to inform you of the correction of an error in the SD for the part(s) on the attached list. For details, please see below. No change to parts - Form/Fit/Function | Download |
| 04/30/2022 | 511285 - Equipment Transfer, Production Transfer or Rearrangement. To better serve our customers and to leverage our global manufacturing footprint Molex will relocate production of the Wafer Ass'y lines from Japan to Molex Vietnam production facility the transfer will be started in Q1 2022 and target to complete in 2022 buffer stock and capacity tooling will be built as needed to ensure a seamless transfer | Download |