| Attribute | Value |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 47553-1001 |
| Part Aliases: | 0475531001 |
| SKU: | MOL47553-1001 |
47553-1001
Specifications
Detailed Description
Introducing the 47553-1001, a high-performance mini-SIM connector designed for reliable surface mount applications. With a low amperage rating of .5 A and a voltage capacity of 50 VDC, this connector is perfect for compact electronic devices. Constructed with durable thermoplastic housing and featuring gold-plated copper alloy contacts, it ensures secure and efficient signal transmission. Operating flawlessly in temperatures ranging from -40 to 85 °C, this connector is suitable for a wide range of environments. With a pitch of 2.54 mm and 6 loaded contacts, it offers excellent connectivity for memory cards and other compatible devices. RoHS compliant and lead-free process capable, the 47553-1001 is the ideal choice for high-quality and environmentally conscious electronic designs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download | |||
| 06/30/2016 | GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance. | Download | |||
| 06/10/2016 | GCM 10732806 - Change In Test / Inspection Methods. Molex Chengdu plan to do the process change on 47533 series manual assembly line. We will use auto CCD inspection and packaging station to replace current 3 manual stations(Manual CCD inspection 6pin contact height/Gauge check coplanarity/Manual FG packaging machine). All validation is in process and we are expecting to complete the changeover action in the 2016/5/10. This will improve our product's quality performance. | Download | |||

