47553-0001

ICC Number:	MOL47553-0001
Manufacturer:	Molex
Manufacturer Number:	47553-0001
Datasheet:	Datasheet
ECAD Model:

Description:

1.27mm Pitch SIM Card Holder with 2 Detect Pins, 6 Circuits, Push-Push Style, Housing Height 1.80mm, without Pegs, Lead-Free

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Specifications

Attribute	Value
Product Category:	Memory Sockets & Connectors SIM, Micro-SIM & UIM Memory Card Connectors
Manufacturer:	Molex
Manufacturer Part Number:	Molex 47553-0001
Series:	47553 - mini-SIM
Amperage:	.5 A
Connector Type:	mini-SIM
Housing Material:	Thermoplastic
Number of Contacts:	6
Termination Method:	Surface Mount
Contact Material:	Copper Alloy
Contact Plating:	Gold Over Nickel
Maximum Operating Temperature:	85 °C
Minimum Operating Temperature:	-40 °C
Pitch:	2.54 mm
Voltage:	50 VDC
Material:	High Temperature Thermoplastic
Shell Material:	Stainless Steel
Operating Temperature Range:	-40 - 85 °C
Contact Mating Area Plating:	Gold over Nickel
Contact Mating Area Plating Thickness:	2.54 mm
Number of Contacts Loaded:	6
Mating Cycles:	2500
PCB Locator:	No
Shielded:	Yes
PCB Retention:	Yes
Contact Termination Plating Thickness:	1.27 mm
Contact Termination Plating:	Gold
Maximum Solder Process Temperature:	250 °C
Lead Free Process Capability:	REFLOW
Duration at Max. Process Temperature (seconds):	010
Max. Cycles at Max. Process Temperature:	002
Card Detection Switch:	Open
Card Entry Location:	Front
Part Aliases:	0475530001
SKU:	MOL47553-0001

Detailed Description

Introducing the 47553-0001, a high-performance mini-SIM connector designed for reliable surface mount applications. With a low amperage rating of .5 A and a voltage of 50 VDC, this connector is perfect for compact electronic devices. Constructed with a durable thermoplastic housing and featuring six copper alloy contacts with gold plating, it ensures excellent conductivity and longevity. Operating efficiently in a wide temperature range from -40 to 85 °C, it is suitable for various environments. With a pitch of 2.54 mm and PCB retention, it offers easy and secure installation. RoHS compliant and lead-free process capable, it meets environmental standards. Trust the 47553-0001 for your connectivity needs in memory card applications.

Product Change Notice

Effective Date	Description of Change	Download
01/03/2025	515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change.	Download
04/30/2023	513394 - Retraction modification of PCN 512019. this pcn is to make some modifications to the previous pcn 512019 because of resource and strategy adjustment molex decides to suspend alternative material study/qualification on some products during this PCN	Download
07/14/2022	512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function.	Download
06/30/2016	GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance.	Download
06/10/2016	GCM 10732806 - Change In Test / Inspection Methods. Molex Chengdu plan to do the process change on 47533 series manual assembly line. We will use auto CCD inspection and packaging station to replace current 3 manual stations(Manual CCD inspection 6pin contact height/Gauge check coplanarity/Manual FG packaging machine). All validation is in process and we are expecting to complete the changeover action in the 2016/5/10. This will improve our product's quality performance.	Download