| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44144-0005 |
| Housing Material: | High Temperature Plastic |
| Number of Contacts: | 6 |
| Termination Method: | Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Port Configuration: | 1x1 |
| Mating Cycles: | 500 |
| Shielded: | No |
| Current Rating: | 1.5 A |
| Voltage Rating: | 150 VAC |
| Operating Temperature: | -40 to 70 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Surface Mount |
| Integrated Magnetics: | No |
| Performance Category: | Cat3 |
| SKU: | MOL44144-0005 |
44144-0005
Specifications
Detailed Description
Introducing the 44144-0005, a high-performance Modular Jack designed for seamless connectivity in electronic applications. This Right Angle, Low Profile, Surface Mount jack features 6/6 configuration, ensuring reliable data transmission. With a sleek Black finish, it adds a touch of sophistication to any setup. Crafted from durable High Temperature Thermoplastic and boasting Phosphor Bronze contacts with Gold plating, this female connector guarantees longevity and signal integrity. Its 90° Angle orientation and 1.02 mm pitch offer versatility for PCB layouts. Rated for 150 V AC/DC and 1.5 A, it suits a wide range of power and signal requirements. RoHS compliant and lead-free reflow capable, it meets stringent environmental standards. Whether for consumer electronics or industrial machinery, the 44144-0005 is the perfect choice for high-speed data transfer with uncompromising quality.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 15-91-2025 | 2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | ![]() |
| Molex 26-60-4080 | KK 396 Header, Vertical, Friction Lock, 8 Circuits, Tin (Sn) Plating | ![]() |
| Molex 39-28-1063 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 6 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural | ![]() |
| Molex 43045-0610 | Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 6 Circuits, with Solder Tab, 0.38µm Gold Plating, Glow-Wire Capable, Black | ![]() |
| Molex 43160-2102 | Sabre Vertical Header, 7.50mm Pitch, 2 Circuits, Glow-Wire Capable, 3.81mm Tail Length, for 1.60mm PCB, with Board Lock | ![]() |
| Molex 70543-0003 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 03/22/2018 | 505050 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download | |||
| 11/18/2017 | 501822 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes and quantities. No changes will be made to the product as a result of the packaging change. | Download | |||
| 11/01/2017 | 501881 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or appearance of the parts. Or, it may result in a change to the specification. | Download | |||
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download | |||


