Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43860-0013 |
Color: | Black |
Series: | 43860 - Modular Jack 8/8 - RJ45 |
Amperage: | 1.5 A |
Connector Type: | Modular Jack 8/8, RJ45 |
Gender: | Female |
Mount Type: | Panel Mount |
Termination Method: | Through Hole |
Contact Material: | Brass, Phosphor Bronze |
Contact Plating: | Gold |
Body Orientation: | Right Angle |
Pitch: | 1.02 mm |
Voltage: | 150 V AC/DC |
Material: | High Temperature Thermoplastic |
Number of Ports: | 1 |
Orientation: | 90° Angle |
Component Type: | PCB Jack |
Packaging: | Tray |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 1.27 µm |
Ground to Panel / PCB: | Yes |
Mating Cycles: | 500 |
Panel Mount: | With |
PCB Locator: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.57 mm |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E107635 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | 1.02 mm |
Surface Mount Compatible: | No |
Non Magnetic: | Yes |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0438600013 |
SKU: | MOL43860-0013 |
43860-0013
Heilind Number: | MOL43860-0013 |
Manufacturer: | Molex |
Manufacturer Number: | 43860-0013 |
Datasheet: | RoHS Certificate of Compliance |
ECAD Model: |
Description:
Modular Jack, Right Angle, Low Profile, Inverted, Shielded, Offset Panel Grounding Tabs, 8/8
More >>Specifications
Detailed Description
Introducing the 43860-0013, a high-performance Modular Jack designed for seamless connectivity in networking applications. This Right Angle, Low Profile jack features an Inverted design with Shielding for enhanced signal integrity. Its Offset Panel Grounding Tabs ensure reliable grounding, while the 8/8 configuration offers full compatibility with RJ45 connectors. Crafted from durable High Temperature Thermoplastic, this jack is built to last in demanding environments. With a female gender and Panel Mount installation, it provides easy and secure connections. Gold-plated contacts and Tin termination guarantee optimal conductivity and corrosion resistance. UL and CSA certified, RoHS compliant, and lead-free solder capable, this jack meets stringent quality and environmental standards. Perfect for use in a wide range of industries, from telecommunications to industrial automation, the 43860-0013 is the ideal choice for your connectivity needs.
Frequently Bought Together
Product | Part # | Description | Stock |
---|---|---|---|
![]() | Molex 08-52-0072 | KK 396 Crimp Terminal 2478, 18-24 AWG, Bag, Phosphor Bronze, Tin (Sn) | ![]() |
![]() | Molex 09-50-3031 | KK 3.96mm Crimp Terminal Housing, Friction Ramp, 3 Circuits, Natural | ![]() |
![]() | Molex 10-89-7061 | 2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, Tin (Sn) Plating, 2.72mm PC Tail Length | ![]() |
![]() | Molex 19002-0024 | Avikrimp Fully Insulated Quick Disconnect, Female, for 14-16 AWG Wire, Box | ![]() |
![]() | Molex 19019-0004 | Avikrimp Quick Disconnect, Female, for 18-22 (0.80-0.35mm?) Wire, Box, Tab 2.79 x 0.81mm | ![]() |
![]() | Molex 26-48-1026 | KK 396 Breakaway Header, Right-Angle with Friction Lock, 2 Circuits, Tin (Sn) Plating | ![]() |
![]() | Molex 26-60-4020 | KK 396 Header, Vertical, Friction Lock, 2 Circuits, Tin (Sn) Plating | ![]() |
![]() | Molex 43045-1402 | Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 14 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black | ![]() |
![]() | Molex 53047-0610 | 1.25mm Pitch PicoBlade Wire-to-Board Header, Vertical, with Friction Lock, 6 Circuits | ![]() |
![]() | Molex 53048-0210 | 1.25mm Pitch PicoBlade Header, Right Angle, 2 Circuits | ![]() |
![]() | Molex 70553-0007 | 2.54mm Pitch SL Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 8 Circuits, 0.38 | ![]() |
Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download | |||
05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download | |||
09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download | |||
01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download | |||
06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download |