43650-0612

Heilind Number:MOL43650-0612
Manufacturer:Molex
Manufacturer Number:43650-0612
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 6 Circuits, with Solder Tab, Tin, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0612
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:6
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:6
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500612
SKU:MOL43650-0612

Detailed Description

The Micro-Fit 3.0 Right-Angle Header, featuring a 3.00mm pitch, is a versatile connectivity solution for your PCB needs. With six circuits and solder tabs for secure attachment, this header ensures reliable power and signal transmission. Its tin plating and glow-wire capability enhance safety and durability, while its black housing adds a sleek touch to your design. Constructed from high-temperature thermoplastic, it can withstand harsh operating conditions from -40 to 105 °C. Fully shrouded and polarized, this connector guarantees proper mating alignment. RoHS compliant and lead-free reflow capable, the Micro-Fit 3.0 is not only environmentally friendly but also easy to integrate into your assembly process, making it the ideal choice for your wire-to-board or wire-to-wire applications.