| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43650-0429 |
| Gender: | Male |
| Number of Contacts: | 4 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Pitch: | 3 mm |
| Shroud Type: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 8.5 A |
| Voltage Rating: | 600 V |
| Operating Temperature: | -40 to 125 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | Header |
| SKU: | MOL43650-0429 |
43650-0429
Specifications
Detailed Description
The Micro-Fit 3.0 Vertical Header is a high-performance PCB connector designed for reliability in power and signal applications. With a 3.00mm pitch and featuring a single row configuration, this header accommodates 4 circuits, allowing for efficient cable connections. Constructed from durable high-temperature thermoplastic with gold-plated brass contacts, it offers excellent conductivity and longevity. The inclusion of a PCB polarizing peg ensures secure and accurate mating. Rated for 600V and 8.5A, with glow-wire capability, this connector is suitable for a wide range of electronic devices. Its straight body orientation and vertical termination method with through-hole mounting make it versatile for various PCB designs. RoHS compliant and lead-free process capable, the Micro-Fit 3.0 guarantees both performance and environmental responsibility.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 54819-0519 | Mini USB, B-Receptacle, Right-Angle, Through Hole Solder Tails and Shell Tabs, Lead-Free | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download | |||
| 06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. | Download | |||


