43650-0304

Heilind Number:MOL43650-0304
Manufacturer:Molex
Manufacturer Number:43650-0304
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 3 Circuits, with PCB Press-fit Metal Retention Clip, Gold, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0304
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:3
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:3
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500304
SKU:MOL43650-0304

Detailed Description

The Micro-Fit 3.0 Right-Angle Header, featuring a 3.00mm pitch and a single row design, is essential for efficient PCB connectivity in various electronic applications. With 3 circuits, each equipped with a durable brass contact material and gold plating in the mating area, this header ensures reliable power and signal transmission. Its PCB press-fit metal retention clip, along with a high-temperature thermoplastic body, guarantees secure and stable attachment, even in demanding environments. Rated for 8.5 A and 600 V, with a wide operating temperature range of -40 to 105 °C, this header is both high-performing and resilient. RoHS-compliant and lead-free solder compatible, it meets international standards for environmental responsibility. Ideal for wire-to-board connections, the Micro-Fit 3.0 is a premium choice for designers and engineers seeking quality, durability, and performance in their electronic assemblies.