43045-1201

Heilind Number:MOL43045-1201
Manufacturer:Molex
Manufacturer Number:43045-1201
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 12 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43045-1201
Color:Black
Series:43045
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:12
Number of Rows:2
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:12
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:10.29 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0430451201
SKU:MOL43045-1201

Detailed Description

Introducing the Micro-Fit 3.0 Right-Angle Header, a high-performance connectivity solution for your PCB projects. This dual-row header features 12 circuits, with a convenient snap-in plastic peg PCB lock for secure installation. With gold contact plating and glow-wire capability, it ensures reliable and durable connections, even in demanding environments. The black high-temperature thermoplastic body, rated for operating temperatures between -40 and 105 °C, offers excellent durability. Designed for through-hole termination on 1.6mm thick PCBs, this header is perfect for wire-to-board applications. With RoHS compliance and lead-free solder process capability, it meets international standards for environmental responsibility. Upgrade your design with the Micro-Fit 3.0 Right-Angle Header for efficient and dependable power and signal transmission.