| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-64-4030 |
| Gender: | Male |
| Number of Contacts: | 3 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Tin |
| Pitch: | 3.96 mm |
| Shrouded: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 7 A |
| Voltage Rating: | 250 V |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL26-64-4030 |
26-64-4030
Specifications
Detailed Description
The 26-64-4030 is a vertical KK 396 Header featuring a friction lock and press-fit plastic peg for secure PCB connection. With 3 tin-plated circuits, it offers a maximum amperage of 7A and can withstand voltages up to 250V. Constructed with brass contacts and a straight body orientation, this connector ensures reliable performance. Each contact is loaded with a 5.08 µm tin plating, and the header is UL and CSA certified for quality assurance. Suitable for wire-to-board applications, it is lead-free and RoHS compliant, making it an environmentally friendly choice for your projects.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 10-84-4030 | 6.35mm Pitch MLX Power Connector Header, Vertical, 3 Circuits, PA Polyamide Nylon 6/6 94V-2, Tin (Sn) Plating, White | ![]() |
| Molex 22-23-2021 | KK 254 Solid Header, Vertical, with Friction Lock, 2 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length | ![]() |
| Molex 26-64-4020 | KK 396 Header, Vertical, Friction Lock with Press-fit Plastic Peg PCB, 2 Circuits, Tin (Sn) Plating | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 01/01/2018 | 503290 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||


