| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-61-5060 |
| Gender: | Male |
| Number of Contacts: | 6 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold, Tin |
| Pitch: | 3.96 mm |
| Shroud Type: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 7 A |
| Voltage Rating: | 250 V |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL26-61-5060 |
26-61-5060
Specifications
Detailed Description
Introducing the 26-61-5060, a high-performance KK 396 Header designed for reliable board-to-wire connections in electronic applications. This right-angle connector features six gold-plated (Au) circuits, offering enhanced conductivity and signal integrity. With a current rating of 7A and a voltage of 250V, it ensures robust power delivery. The brass contacts with matte tin termination guarantee durability, even in demanding environments. Its low-profile polyester body, meeting CSA and UL standards, is ideal for space-restricted designs. The connector is RoHS compliant and suitable for lead-free soldering processes, making it environmentally friendly. Perfect for use in various industries, the 26-61-5060 is a dependable solution for your connectivity needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 43045-0612 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 6 Circuits, with PCB Polarizing Peg, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||


