26-60-4140

ICC Number:	MOL26-60-4140
Manufacturer:	Molex
Manufacturer Number:	26-60-4140
Datasheet:	Datasheet
ECAD Model:

Description:

KK 396 Header, Vertical, Friction Lock, 14 Circuits, Tin (Sn) Plating

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Specifications

Attribute	Value
Product Category:	PCB Connectors PCB Headers & Receptacles
Manufacturer:	Molex
Manufacturer Part Number:	Molex 26-60-4140
Gender:	Male
Number of Contacts:	14
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	3.96 mm
Shrouded:	Yes
Flammability Rating:	UL 94V-0
Current Rating:	7 A
Voltage Rating:	600 V
Mounting Angle:	Straight
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL26-60-4140

Detailed Description

Introducing the 26-60-4140, a versatile KK 396 Header designed for vertical applications with friction lock functionality, featuring 14 tin-plated circuits for reliable connectivity. Constructed with high-quality natural polyester material, this header is RoHS compliant and rated for 7A and 250V. With brass contacts and through-hole termination, it ensures secure and durable performance. The straight body orientation and 3.96mm pitch make it ideal for various PCB projects. Each of the 14 contacts is loaded for efficient wire-to-board connections, with a mating cycle of 25. This KK Connector System component is stackable and polarized for easy mating, perfect for a wide range of electronics applications.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 02-09-2101	2.36mm Diameter, Standard .093 Pin and Socket Crimp Terminal, Series 1190, Male, with Tin (Sn) Plated Brass Contact, 14-20 AWG, Reel
	Molex 26-48-1025	KK 396 Breakaway Header, Vertical, Square Pin, with Friction Lock, 2 Circuits, 1.52µm Matte Tin (Sn) Plating, 4.37mm Tail Length, 11.43mm Mating Pin Length
	Molex 26-60-4040	KK 396 Header, Vertical, Friction Lock, 4 Circuits, Tin (Sn) Plating

Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
02/28/2022	511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.	Download
11/12/2021	510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date.	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
03/15/2019	506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.	Download
07/01/2017	502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download