| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 22-12-2164 |
| Gender: | Male |
| Number of Contacts: | 16 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Pitch: | 2.54 mm |
| Shroud Type: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 4 A |
| Voltage Rating: | 500 V |
| Operating Temperature: | -40 to 80 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL22-12-2164 |
22-12-2164
Specifications
Detailed Description
Introducing the 22-12-2164 KK 254 Solid Header, a high-quality right angle connector with friction lock feature, designed for reliable performance in electronic applications. This header accommodates 16 circuits with a pitch of 2.54mm, constructed with durable brass contacts and a nylon body for enhanced longevity. With a current rating of 4A and voltage withstand of 500V, it ensures efficient power transmission. Gold contact mating area plating offers superior conductivity, suitable for through hole termination. Featuring UL and CSA certifications, this connector meets stringent quality standards. Its compact design, with partial shrouding and polarization, allows for secure and space-saving PCB connections. RoHS compliant and lead-free solder capable, the KK 254 Solid Header is ideal for various industries, guaranteeing performance and reliability.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 11/30/2020 | 509221 - Retraction of PCN 506276. retraction of DU min & MLQ Min qty update for kk part numbers | Download | |||
| 09/01/2019 | 507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
| 07/01/2019 | 507163 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download | |||
| 04/25/2019 | 506276 - Packaging Method/Quantity Changing. The part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/12/2018 | 505757 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||
| 03/18/2016 | 500669 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes and quantities. No changes will be made to the product as a result of the packaging change. | Download | |||
| 02/01/2012 | GCM 10523658 - Changing selected Mini-Fit and KK Product that were Overall Gold Plated Terminals to Select Gold, or Gold only in the contact area, and Matte Tin in solder tail area (changing solder tails from Overall Gold Plating to Matte Tin Plating). | Download | |||
| 02/01/2012 | GCM 10534789 - Plating changed from all over Gold Plating to Selective Gold Plating. | N/A | |||

